

Wafers are ultra-precision semiconductor substrates. During production, transit and storage, they are extremely sensitive to static, moisture, dust and EMI. Minor static breakdown or moisture oxidation will cause wafer scrap and reduce production yield. XCGS ESD aluminum foil bags are premium protective packaging for wafer fabs. Made of 4-layer co-extruded composite film with pure aluminum shielding to form a Faraday cage. Surface resistance ranges from 10⁴ to 10¹¹ Ω to dissipate static rapidly and prevent static damage.
Manufactured in Class 100 / Class 1000 clean-rooms, the bags have no silicon precipitation or dust residue to avoid contamination on wafer surfaces and circuit patterns. Excellent barrier performance blocks oxygen, moisture and external electromagnetic waves, ideal for long-term storage & circulation of 8-inch and 12-inch wafers.
Compliant with IEC 61340-5-1 Class 1 international ESD standard. Suitable for advanced substrates including GAA transistor wafers and stacked wafers, essential packaging material for wafer manufacturers and semiconductor foundries.